通信 卫星通信(1) 无线通信(1)

信息器件 新材料(1) 新器件(4) 量子(1)

Special Focus on Deep Space Communications
通信 卫星通信 PROGRESS Webpage Webpage-cn SpringerLink Google Scholar Cited in SCI: 7

Review of channel models for deep space communications
Pan, Xiaohan; Zhan, Yafeng; Wan, Peng; Lu, Jianhua
Sci China Inf Sci, 2018, 61(4): 040304
Keywords: deep space communication; channel modeling; microwave communication; optical communication; deep space exploration
Cite as: Pan X H, Zhan Y F, Wan P, et al. Review of channel models for deep space communications. Sci China Inf Sci, 2018, 61(4): 040304, doi: 10.1007/s11432-017-9345-8

SCIS Selected Articles on 6G
SCIS Selected Articles on Thz Communication
通信 无线通信 PROGRESS Webpage Webpage-cn SpringerLink Google Scholar Cited in SCI: 33

Ultra-wideband fiber-THz-fiber seamless integration communication system toward 6G: architecture, key techniques, and testbed implementation
Zhu, Min; Zhang, Jiao; Hua, Bingchang; Lei, Mingzheng; Cai, Yuancheng; Tian, Liang; Wang, Dongming; Xu, Wei; Zhang, Chuan; Huang, Yongming; Yu, Jianjun; You, Xiaohu
Sci China Inf Sci, 2023, 66(1): 113301
Keywords: 6G; THz wireless communication; optical fiber communication; seamlessly converged architecture; real-time communication
Cite as: Zhu M, Zhang J, Hua B C, et al. Ultra-wideband fiber-THz-fiber seamless integration communication system toward 6G: architecture, key techniques, and testbed implementation. Sci China Inf Sci, 2023, 66(1): 113301, doi: 10.1007/s11432-022-3565-3

Special Topic: Two-Dimensional Materials and Device Applications
信息器件 新材料 PROGRESS Webpage Webpage-cn SpringerLink Google Scholar Cited in SCI: 12

From lab to fab: path forward for 2D material electronics
Ning, Hongkai; Yu, Zhihao; Li, Taotao; Shen, Haoliang; Long, Gen; Shi, Yi; Wang, Xinran
Sci China Inf Sci, 2023, 66(6): 160411
Keywords: two-dimensional materials; transition-metal dichalcogenides; equipment; integrated circuits; roadmap
Cite as: Ning H K, Yu Z H, Li T T, et al. From lab to fab: path forward for 2D material electronics. Sci China Inf Sci, 2023, 66(6): 160411, doi: 10.1007/s11432-023-3752-3

Special Focus on Near-memory and In-memory Computing
信息器件 新器件 PROGRESS Webpage Webpage-cn SpringerLink Google Scholar Cited in SCI: 92

Breaking the von Neumann bottleneck: architecture-level processing-in-memory technology
Zou, Xingqi; Xu, Sheng; Chen, Xiaoming; Yan, Liang; Han, Yinhe
Sci China Inf Sci, 2021, 64(6): 160404
Keywords: processing-in-memory (pim); von neumann bottleneck; memory wall; pim simulator; architecture-level pim
Cite as: Zou X Q, Xu S, Chen X M, et al. Breaking the von Neumann bottleneck: architecture-level processing-in-memory technology. Sci China Inf Sci, 2021, 64(6): 160404, doi: 10.1007/s11432-020-3227-1

Special Topic: Recent Progress of Fundamental Research on Post-Moore Novel Devices
信息器件 新器件 PROGRESS Webpage Webpage-cn SpringerLink Google Scholar Cited in SCI: 3

Research progress on low-power artificial intelligence of things (AIoT) chip design
Ye, Le; Wang, Zhixuan; Jia, Tianyu; Ma, Yufei; Shen, Linxiao; Zhang, Yihan; Li, Heyi; Chen, Peiyu; Wu, Meng; Liu, Ying; Jing, Yiqi; Zhang, Hao; Huang, Ru
Sci China Inf Sci, 2023, 66(10): 200407
Keywords: artificial intelligence; Internet of Things; low-power; chip design; random sparse event
Cite as: Ye L, Wang Z X, Jia T Y, et al. Research progress on low-power artificial intelligence of things (AIoT) chip design. Sci China Inf Sci, 2023, 66(10): 200407, doi: 10.1007/s11432-023-3813-8

Special Topic: Recent Progress of Fundamental Research on Post-Moore Novel Devices
信息器件 新器件 PROGRESS Webpage Webpage-cn SpringerLink Google Scholar Cited in SCI: 7

Architecture-circuit-technology co-optimization for resistive random access memory-based computation-in-memory chips
Liu, Yuyi; Gao, Bin; Tang, Jianshi; Wu, Huaqiang; Qian, He
Sci China Inf Sci, 2023, 66(10): 200408
Keywords: resistive random-access memory; computation-in-memory; compact model; device-architecture-algorithm co-design; compiler
Cite as: Liu Y Y, Gao B, Tang J S, et al. Architecture-circuit-technology co-optimization for resistive random access memory-based computation-in-memory chips. Sci China Inf Sci, 2023, 66(10): 200408, doi: 10.1007/s11432-023-3785-8

Special Topic: Recent Progress of Fundamental Research on Post-Moore Novel Devices
信息器件 新器件 PROGRESS Webpage Webpage-cn SpringerLink Google Scholar Cited in SCI: 0

Breaking the energy-efficiency barriers for smart sensing applications with “Sensing with Computing” architectures
Yang, Xinghua; Liu, Zheyu; Tang, Kechao; Yin, Xunzhao; Zhuo, Cheng; Wei, Qi; Qiao, Fei
Sci China Inf Sci, 2023, 66(10): 200409
Keywords: low power consumption circuit design; sensing with computing; smart sensors; edge computing; multi-modal sensing
Cite as: Yang X H, Liu Z Y, Tang K C, et al. Breaking the energy-efficiency barriers for smart sensing applications with “Sensing with Computing” architectures. Sci China Inf Sci, 2023, 66(10): 200409, doi: 10.1007/s11432-023-3760-8

Special Topic: Quantum Information
信息器件 量子 PROGRESS Webpage Webpage-cn SpringerLink Google Scholar Cited in SCI: 8

Quantum NETwork: from theory to practice
Fang, Kun; Zhao, Jingtian; Li, Xiufan; Li, Yifei; Duan, Runyao
Sci China Inf Sci, 2023, 66(8): 180509
Keywords: quantum network; quantum internet; quantum network architecture; quantum network protocol; quantum network simulation; quantum software toolkit
Cite as: Fang K, Zhao J T, Li X F, et al. Quantum NETwork: from theory to practice. Sci China Inf Sci, 2023, 66(8): 180509, doi: 10.1007/s11432-023-3773-4